Tin-Reflow Fusing

DID YOU KNOW THAT WHISKER GROWTH IS THE SINGLE GREATEST REPEAT FAILURE IN THE ELECTRONIC INDUSTRY TODAY? AND THAT THE MAIN CONTRIBUTER IS BRIGHT TIN PLATING?

THE REFLOW PROCESS WAS DEVELOPED TO ELIMINATE WHISKER GROWTH. RFC'S GOAL TO MEET GTLO, RoHS, and WEEE, Standards are now available. Whisker growth elimination top priority. The process is cost effective, better than gold, with long shelf life. NO SIGNS OF WHISKER GROWTH on tests to date. The specification MIL T 10727 covers two types of plating and they are not compatible: Pros and Cons MIL-T-10727-1 matte finish "Can" be reflowed; MIL-T-10727-2 Bright Tin "Can Not" be reflowed.

To explain "tin whiskers," we will direct you to a research site by NASA.

Ring Samples

 

Reflow Parts

 

 

NASA Whisker Simulation

 

 

NASA's Limitations of "Hot Solder Dip" for Tin Whisker Mitigation